• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Since the semiconductor package of the present invention includes a first pin group for inserting through the PCB hole and wiring at the back of the PCB substrate, and a second pin group for wiring at the front of the PCB substrate, Compared to the conventional semiconductor package, which can be wired only on one side, the package itself can be reduced and circuit wiring of the PCB can be simplified.
    公开号:KR19990030767A
    申请号:KR1019970051165
    申请日:1997-10-06
    公开日:1999-05-06
    发明作者:윤영환
    申请人:윤종용；삼성전자 주식회사；
    IPC主号:
    专利说明:

    Semiconductor package
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, and more particularly, to a semiconductor package capable of using both surfaces of a PCB substrate during circuit formation.
    To mount a semiconductor package on a PCB substrate, a lead shape formed at right angles to both sides of the package, such as DIP (Dual Inline Package), and a galling shape of FP (Flat Package) / SOP (Small Outline Package) according to the mounting method. Various lead shapes such as J band shape of PLCC (Plastic Leaded Chip Carrier) are required.
    As shown in FIG. 1, a through hole for insertion is prepared in the PCB 30 for wiring, and the pin 20 of the package 10 is inserted into the through hole to lead 40. A hole insertion package to be fixed and wired, and the FP / SOP and PLCC do not require the through hole as shown in FIG. 2 and are surface mount packages for mounting the package on the PCB 30 surface. .
    However, in the conventional semiconductor package, the input / output pins increase as the integrated circuit is largely integrated, whereas the use of the PCB substrate is very limited in consideration of the trend of miniaturization, light weight, and high density mounting of electronic devices using most integrated circuits. There is a problem.
    Accordingly, an object of the present invention is to provide a semiconductor package that can use both sides of the PCB substrate in order to solve the problems of the prior art.
    The semiconductor package of the present invention for achieving the above object is a semiconductor package having a plurality of pins protruding out of the molding resin, the plurality of pins are inserted into the through-hole of the PCB substrate in the back of the PCB substrate And a second pin group for wiring and a second pin group for wiring in front of the PCB.
    1 illustrates a state in which a hole insertion-mounted semiconductor package is wired to a PCB substrate,
    2 illustrates a state in which a surface mount semiconductor package is wired to a PCB substrate;
    3 shows a state in which a semiconductor package according to the present invention is wired to a PCB substrate.
    <Explanation of symbols for main parts of the drawings>
    110: molding resin 120: first pin group
    120 ': second pin group 130: PCB substrate
    140: lead
    Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.
    As shown in FIG. 3, the semiconductor package of the present invention includes a molding resin 110 encapsulating a semiconductor die and a lead frame in which an integrated circuit is integrated, and protrudes to the outside of the molding resin 110, such as the pins of the DIP. A first pin group 120 ′ inserted into a through hole of the PCB substrate 130 so as to be fixed and wired using a lead 140 at a rear surface of the PCB substrate 130, and a pin of the SOP; The second pin group 120 is configured to be wired using a lead 140 or the like on the front surface of the PCB 130 in a galling shape.
    The semiconductor package of the present invention includes a first metal layer having an inner metal layer connected to the first fin group 120 ′ and a second metal layer connected to the second fin group.
    As described above, according to the present invention, there is an effect that the circuit wiring of the PCB can be simplified by reducing the area of the package and wiring to both sides of the PCB.
    权利要求:
    Claims (1)
    [1" claim-type="Currently amended] A semiconductor package having a plurality of pins protruding out of a molding resin, the plurality of pins being inserted into a through hole of a PCB substrate and having a first pin group for wiring on the back surface of the PCB substrate; And a second group of pins for wiring from the front side.
    类似技术:
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1997-10-06|Application filed by 윤종용, 삼성전자 주식회사
    1997-10-06|Priority to KR1019970051165A
    1999-05-06|Publication of KR19990030767A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019970051165A|KR19990030767A|1997-10-06|1997-10-06|Semiconductor package|
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